MULTI-PHYSICS SIMULATION IN THE 21st CENTURY.

Email: info@physica.co.uk

[ ALUMINIUM REDUCTION CELL ]   [ CASTING & SOLIDIFICATION ]
[ ELECTRONICS APPLICATIONS ]   [ FORMING ]   [ GRANULAR FLOWS ]
[ STEEL PROCESSING ]   [ WELDING ]

Electronic product design and manufacturing

The electronic manufacturing and product design sector is now the worlds largest and fastest growing manufacturing industry, and in the UK has grown from 7 to 10 % of GDP within the last two years. Its rate of technology progress has been extremely rapid. This is continuing, with the dominant market pressure being to reduce the time to design and manufacture new products. Research to underpin this industry is therefore of national importance. Technology roadmaps for this sector continually emphasise the requirement for improved design tools that permit integrated modelling and simulation of materials and processes to accommodate the required rapid advancements in technology. PHYSICA is helping fulfil this requirement where its multi-physics capability is simulating some of the latest chip designs and interconnections including standard surface mount technology as well as Ball Grid Array and Flip-Chip technologies. These simulations are providing details relevant to thermal, mechanical, and electrical compatibility of components found in products such as mobile phones, supercomputers, camcorders, and many other devices based on electrical and opto-electronic technologies.

Simulation results

• Flip chip model [ IMAGE ]
• Liquid fractions in solder bumps [ IMAGE ]
• Plastic strain due to thermal cycle [ IMAGE ]
• Reflow modelling (thermal stress) [ IMAGE ]
• Void movement in interconnects using level sets [ IMAGE ]
• Non-Newtonian flow of solder paste [ IMAGE ]

A presentation in pdf format (1.5MB), related to electronic design using PHYSICA is available to download [ DOWNLOAD ].